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1.

Biology's new dimension
by Abbott, Alison

Nature (London), 2003, Vol.424 (6951), p.870-872

3.

Three-dimensional silicon integration
by Knickerbocker, J.U

IBM journal of research and development, 2008, Vol.52 (6), p.553-569

7.

Wafer-level 3D integration technology
by Koester, S.J

IBM journal of research and development, 2008, Vol.52 (6), p.583-597

13.

Intelligent Visual Media Processing: When Graphics Meets Vision
by Cheng, Ming-Ming

Journal of computer science and technology, 2017, Vol.32 (1), p.110-121

14.

A Survey on Partial Retrieval of 3D Shapes
by Liu, Zhen-Bao

Journal of computer science and technology, 2013, Vol.28 (5), p.836-851

15.

Thermomechanical modeling of 3D electronic packages
by Sri-Jayantha, S.M

IBM journal of research and development, 2008, Vol.52 (6), p.623-634

16.

3D chip stacking with C4 technology
by Dang, B

IBM journal of research and development, 2008, Vol.52 (6), p.599-609

17.

Skeleton-Sectional Structural Analysis for 3D Printing
by Xu, Wen-Peng

Journal of computer science and technology, 2016, Vol.31 (3), p.439-449

20.

OpenTracker: A flexible software design for three-dimensional interaction
by Reitmayr, Gerhard

Virtual reality : the journal of the Virtual Reality Society, 2005, Vol.9 (1), p.79-92

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