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3.

Investigation of rare earth-doped BiAg high-temperature solders
by Shi, Yaowu

Journal of Materials Science: Materials in Electronics, 2010, Vol.21(9), pp.875-881

8.

Effect of rare earth addition on shear strength of SnAgCu lead-free solder joints
by Li, Guangdong

Journal of Materials Science: Materials in Electronics, 2009, Vol.20(2), pp.186-192

10.

Investigation on impact strength of the as-soldered Sn37Pb and Sn3.8Ag0.7Cu solder joints
by Zhang, Ning

Journal of Materials Science: Materials in Electronics, 2009, Vol.20(6), pp.499-506

11.

Creep property of composite solders reinforced by nano-sized particles
by Shi, Yaowu

Journal of Materials Science: Materials in Electronics, 2008, Vol.19(4), pp.349-356

12

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