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6.

Thermal stability of germanium-tin (GeSn) fins
by Lei, Dian

Applied Physics Letters, 18 December 2017, Vol.111(25)

18.

Control wafer bow of ingap on 200 mm si by strain engineering
by Wang, Bing

Semiconductor Science and Technology, 2017, Vol.32(12), p.125013 (7pp)

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