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2.

Consequences of transvaginal follicular puncture on well-being of cows
by Chastant-Maillard , S.

Reproduction : the Journal of the Society for Reproduction and Fertility, 2003, Vol.125(4), pp.555-563

4.

Competing Fracture Modeling of Thin Chip Pick-Up Process
by Bo Peng

IEEE Transactions on Components, Packaging and Manufacturing Technology, July 2012, Vol.2(7), pp.1217-1225

5.

Analysis of Interfacial Peeling of an Ultrathin Silicon Wafer Chip in a Pick-Up Process Using an Air Blowing Method
by Eun-Beom Jeon

IEEE Transactions on Components, Packaging and Manufacturing Technology, November 2016, Vol.6(11), pp.1696-1702

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