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1.
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Diffusivities and Atomic Mobilities of Sn-Bi and Sn-Pb Melts
by Chen, Wei-Min

Journal of Electronic Materials, 2013, Vol.42(6), pp.1158-1170

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2.
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Effects of Thermal Aging on Microstructure and Microhardness of Sn-3.7Ag-0.9Zn-1In Solder
by Wei, Chen

Journal of Electronic Materials, 2009, Vol.38(2), pp.345-350

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3.
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Interfacial Reactions in Sn-Ag/Co Couples
by Chen, Sinn-wen

Journal of Electronic Materials, 2014, Vol.43(2), pp.636-639

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4.
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Effects of SiC Nanodispersion on the Thermoelectric Properties of p-Type and n-Type [Bi.sub.2]Te.sub.3-Based Alloys.(Report)
by Liu, Da - Wei

Journal of Electronic Materials, May, 2011, Vol.40(5), p.992(7)

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5.
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Diffusivities and Atomic Mobilities of Sn-Ag and Sn-In Melts
by Chen, Wei-Min

Journal of Electronic Materials, 2014, Vol.43(4), pp.1131-1143

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6.
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Influence of Cu content on compound formation near the chip side for the flip-chip Sn-3.0Ag-(0.5 or 1.5)Cu solder bump during aging.(Author abstract)(Report)
by Jang, Guh - Yaw

Journal of Electronic Materials, Sept, 2006, Vol.35(9), p.1745(10)

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7.
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Enhanced Thermoelectric Properties Obtained by Compositional Optimization in p-Type [Bi.sub.x][Sb.sub.2-x]Te.sub.3 Fabricated by Mechanical Alloying and Spark Plasma Sintering.(Rep...
by Chen, Chen

Journal of Electronic Materials, May, 2011, Vol.40(5), p.942(6)

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8.
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Effects of Minor Amounts of Zn on the Sn-Zn/Ni Interfacial Reactions and Phase Equilibria of the Ternary Sn-Zn-Ni System at 250degC.(Report)
by Wang, Chao - Hong

Journal of Electronic Materials, Dec, 2011, Vol.40(12), p.2436(9)

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9.
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Effect of Polyethylene Glycol Additives on Pulse Electroplating of SnAg Solder.(Author abstract)(Report)
by Chen, Hsiao - Yun

Journal of Electronic Materials, Feb, 2008, Vol.37(2), p.224(7)

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