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ISTFA 2013 wrap-up.(ISTFA 2013)

The 39th International Symposium for Testing and Failure Analysis (ISTFA 2013) was held November 3 to 7 at the McEnery Convention Center in San Jose, Calif. It was one of the best-attended ISTFAs, with ~1000 attendees from more than 20 countries around the world, and it had a record number of abstra... Full description

Journal Title: Electronic Device Failure Analysis 2014, Vol.16(1), p.26(3)
Main Author: Gener, Zhiyong Wang
Format: Electronic Article Electronic Article
Language: English
Subjects:
ID: ISSN: 1537-0755
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recordid: bcrc359131062
title: ISTFA 2013 wrap-up.(ISTFA 2013)
format: Article
creator:
  • Gener, Zhiyong Wang
subjects:
  • Conventions
  • Failure Analysis
  • Electronic Devices
  • Forensic Engineering (Mt)
  • Electronic Components and Materials (Ea)
ispartof: Electronic Device Failure Analysis, 2014, Vol.16(1), p.26(3)
description: The 39th International Symposium for Testing and Failure Analysis (ISTFA 2013) was held November 3 to 7 at the McEnery Convention Center in San Jose, Calif. It was one of the best-attended ISTFAs, with ~1000 attendees from more than 20 countries around the world, and it had a record number of abstract submissions.
language: eng
source:
identifier: ISSN: 1537-0755
fulltext: fulltext
issn:
  • 1537-0755
  • 15370755
url: Link


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