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Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient.

Abstract A vacuum-free Cu-to-Cu direct bonding by using (111)-oriented and nanotwinned Cu has been achieved. A fast bonding process occurs in 5 min under a temperature gradient between 450 and 100 °C. It is verified by grain growth across the bonded interface. To investigate the grain growth behavio... Full description

Journal Title: Scientific reports September 17, 2018, Vol.8(1), p.13910
Main Author: Juang, Jing-Ye
Other Authors: Lu, Chia-Ling , Chen, Kuan-Ju , Chen, Chao-Chang A , Hsu, Po-Ning , Chen, Chih , Tu, K N
Format: Electronic Article Electronic Article
Language: English
Subjects:
ID: E-ISSN: 2045-2322 ; DOI: 2045-2322 ; DOI: 10.1038/s41598-018-32280-x
Link: http://search.proquest.com/docview/2109334496/?pq-origsite=primo
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title: Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient.
format: Article
creator:
  • Juang, Jing-Ye
  • Lu, Chia-Ling
  • Chen, Kuan-Ju
  • Chen, Chao-Chang A
  • Hsu, Po-Ning
  • Chen, Chih
  • Tu, K N
subjects:
  • Biology
ispartof: Scientific reports, September 17, 2018, Vol.8(1), p.13910
description: Abstract A vacuum-free Cu-to-Cu direct bonding by using (111)-oriented and nanotwinned Cu has been achieved. A fast bonding process occurs in 5 min under a temperature gradient between 450 and 100 °C. It is verified by grain growth across the bonded interface. To investigate the grain growth behavior, further annealing in the temperature gradient, as well as in a reversed temperature gradient, was performed. They showed similar recrystallization behavior with de-twinning. To analyze the de-twinning, we recall the classic model of annealing twin formation by Fullman and Fisher as comparison. Our case is opposite to the model of Fullman and Fisher. A mechanism of direct bonding by surface diffusion creep is proposed.
language: eng
source:
identifier: E-ISSN: 2045-2322 ; DOI: 2045-2322 ; DOI: 10.1038/s41598-018-32280-x
fulltext: fulltext
issn:
  • 20452322
  • 2045-2322
url: Link


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titleCopper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient.
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descriptionAbstract A vacuum-free Cu-to-Cu direct bonding by using (111)-oriented and nanotwinned Cu has been achieved. A fast bonding process occurs in 5 min under a temperature gradient between 450 and 100 °C. It is verified by grain growth across the bonded interface. To investigate the grain growth behavior, further annealing in the temperature gradient, as well as in a reversed temperature gradient, was performed. They showed similar recrystallization behavior with de-twinning. To analyze the de-twinning, we recall the classic model of annealing twin formation by Fullman and Fisher as comparison. Our case is opposite to the model of Fullman and Fisher. A mechanism of direct bonding by surface diffusion creep is proposed.
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