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High copper loading metal organic decomposition paste for printed electronics

A screen-printable metal organic decomposition (MOD) paste with a high copper loading has been developed. Copper precursor (copper hydroxide and copper formate) and copper flasks are used as copper sources in the paste. The copper precursor is reduced to copper nanoparticles during sintering at a te... Full description

Journal Title: Journal of Materials Science 2017, Vol.52(10), pp.5617-5625
Main Author: Tam, Sze
Other Authors: Fung, Ka , Ng, Ka
Format: Electronic Article Electronic Article
Language: English
Subjects:
ID: ISSN: 0022-2461 ; E-ISSN: 1573-4803 ; DOI: 10.1007/s10853-017-0796-0
Link: http://dx.doi.org/10.1007/s10853-017-0796-0
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recordid: springer_jour10.1007/s10853-017-0796-0
title: High copper loading metal organic decomposition paste for printed electronics
format: Article
creator:
  • Tam, Sze
  • Fung, Ka
  • Ng, Ka
subjects:
  • Hydroxides – Electric Properties
  • Organic Acids – Electric Properties
  • Sintering – Electric Properties
  • Formic Acid – Electric Properties
ispartof: Journal of Materials Science, 2017, Vol.52(10), pp.5617-5625
description: A screen-printable metal organic decomposition (MOD) paste with a high copper loading has been developed. Copper precursor (copper hydroxide and copper formate) and copper flasks are used as copper sources in the paste. The copper precursor is reduced to copper nanoparticles during sintering at a temperature of 200 °C for 3 min and forms a conductive film, whereas the copper flakes are added to increase the conductivity of the printed film. The optimal formulation of the screen-printing MOD paste was obtained with a copper hydroxide to formic acid ratio of 0.875 and by adding copper flakes to reach a total copper loading of 30 wt%. The printed film after sintering had a sheet resistance of 39 mΩ/sq and a volume resistivity of 21 μΩ cm.
language: eng
source:
identifier: ISSN: 0022-2461 ; E-ISSN: 1573-4803 ; DOI: 10.1007/s10853-017-0796-0
fulltext: fulltext
issn:
  • 1573-4803
  • 15734803
  • 0022-2461
  • 00222461
url: Link


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descriptionA screen-printable metal organic decomposition (MOD) paste with a high copper loading has been developed. Copper precursor (copper hydroxide and copper formate) and copper flasks are used as copper sources in the paste. The copper precursor is reduced to copper nanoparticles during sintering at a temperature of 200 °C for 3 min and forms a conductive film, whereas the copper flakes are added to increase the conductivity of the printed film. The optimal formulation of the screen-printing MOD paste was obtained with a copper hydroxide to formic acid ratio of 0.875 and by adding copper flakes to reach a total copper loading of 30 wt%. The printed film after sintering had a sheet resistance of 39 mΩ/sq and a volume resistivity of 21 μΩ cm.
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titleHigh copper loading metal organic decomposition paste for printed electronics
descriptionA screen-printable metal organic decomposition (MOD) paste with a high copper loading has been developed. Copper precursor (copper hydroxide and copper formate) and copper flasks are used as copper sources in the paste. The copper precursor is reduced to copper nanoparticles during sintering at a temperature of 200 °C for 3 min and forms a conductive film, whereas the copper flakes are added to increase the conductivity of the printed film. The optimal formulation of the screen-printing MOD paste was obtained with a copper hydroxide to formic acid ratio of 0.875 and by adding copper flakes to reach a total copper loading of 30 wt%. The printed film after sintering had a sheet resistance of 39 mΩ/sq and a volume resistivity of 21 μΩ cm.
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abstractA screen-printable metal organic decomposition (MOD) paste with a high copper loading has been developed. Copper precursor (copper hydroxide and copper formate) and copper flasks are used as copper sources in the paste. The copper precursor is reduced to copper nanoparticles during sintering at a temperature of 200 °C for 3 min and forms a conductive film, whereas the copper flakes are added to increase the conductivity of the printed film. The optimal formulation of the screen-printing MOD paste was obtained with a copper hydroxide to formic acid ratio of 0.875 and by adding copper flakes to reach a total copper loading of 30 wt%. The printed film after sintering had a sheet resistance of 39 mΩ/sq and a volume resistivity of 21 μΩ cm.
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pubSpringer US
doi10.1007/s10853-017-0796-0
pages5617-5625
date2017-05