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High-concentration copper nanoparticles synthesis process for screen-printing conductive paste on flexible substrate

Byline: Sze Kee Tam (1), Ka Ming Ng (1) Keywords: Copper nanoparticle; Synthesis; Reduction reaction; Particle size; Conductive paste; Printed electronics Abstract: Abstract This study presents a method for the synthesis of copper nanoparticles, which are poised to replace silver nanoparticles in so... Full description

Journal Title: Journal of Nanoparticle Research 2015, Vol.17(12), pp.1-12
Main Author: Tam, Sze
Other Authors: Ng, Ka
Format: Electronic Article Electronic Article
Language: English
Subjects:
ID: ISSN: 1388-0764 ; E-ISSN: 1572-896X ; DOI: 10.1007/s11051-015-3277-x
Link: http://dx.doi.org/10.1007/s11051-015-3277-x
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recordid: springer_jour10.1007/s11051-015-3277-x
title: High-concentration copper nanoparticles synthesis process for screen-printing conductive paste on flexible substrate
format: Article
creator:
  • Tam, Sze
  • Ng, Ka
subjects:
  • Copper nanoparticle
  • Synthesis
  • Reduction reaction
  • Particle size
  • Conductive paste
  • Printed electronics
ispartof: Journal of Nanoparticle Research, 2015, Vol.17(12), pp.1-12
description: Byline: Sze Kee Tam (1), Ka Ming Ng (1) Keywords: Copper nanoparticle; Synthesis; Reduction reaction; Particle size; Conductive paste; Printed electronics Abstract: Abstract This study presents a method for the synthesis of copper nanoparticles, which are poised to replace silver nanoparticles in some application areas of printed electronics. This method offers three advantages. Firstly, copper loading in the synthesis reaction can be as high as 1 M, offering high productivity in large-scale production. Secondly, the size of the copper nanoparticles can be controlled from 12 to 99 nm. Thirdly, the surface polarity of the particles can be modified. Thus, a tailor-made product can be synthesized. The synthesis of copper nanoparticles coated with various capping agents, including dodecanethiol, lauric acid, nonanoic acid, polyacrylic acid, and polyvinyl pyrrolidone, was demonstrated. The nonanoic acid-coated copper nanoparticles were formulated as a screen-printing conductive paste. The particles were readily dispersed in terpineol, and the paste could be screen printed onto flexible polyester. The electrical resistivity of patterns after a low-temperature (120 [degrees]C) sintering treatment was around 5.8 x 10.sup.-5 [OMEGA] cm. Graphical Abstract Author Affiliation: (1) Department of Chemical and Biomolecular Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Hong Kong Article History: Registration Date: 20/11/2015 Received Date: 30/07/2015 Accepted Date: 20/11/2015 Online Date: 30/11/2015
language: eng
source:
identifier: ISSN: 1388-0764 ; E-ISSN: 1572-896X ; DOI: 10.1007/s11051-015-3277-x
fulltext: fulltext
issn:
  • 1572-896X
  • 1572896X
  • 1388-0764
  • 13880764
url: Link


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descriptionByline: Sze Kee Tam (1), Ka Ming Ng (1) Keywords: Copper nanoparticle; Synthesis; Reduction reaction; Particle size; Conductive paste; Printed electronics Abstract: Abstract This study presents a method for the synthesis of copper nanoparticles, which are poised to replace silver nanoparticles in some application areas of printed electronics. This method offers three advantages. Firstly, copper loading in the synthesis reaction can be as high as 1 M, offering high productivity in large-scale production. Secondly, the size of the copper nanoparticles can be controlled from 12 to 99 nm. Thirdly, the surface polarity of the particles can be modified. Thus, a tailor-made product can be synthesized. The synthesis of copper nanoparticles coated with various capping agents, including dodecanethiol, lauric acid, nonanoic acid, polyacrylic acid, and polyvinyl pyrrolidone, was demonstrated. The nonanoic acid-coated copper nanoparticles were formulated as a screen-printing conductive paste. The particles were readily dispersed in terpineol, and the paste could be screen printed onto flexible polyester. The electrical resistivity of patterns after a low-temperature (120 [degrees]C) sintering treatment was around 5.8 x 10.sup.-5 [OMEGA] cm. Graphical Abstract Author Affiliation: (1) Department of Chemical and Biomolecular Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Hong Kong Article History: Registration Date: 20/11/2015 Received Date: 30/07/2015 Accepted Date: 20/11/2015 Online Date: 30/11/2015
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